[luau] Underclocking / Aluminum cases

[Ray Strode]

>
>
>The reason for large copper bottoms is for even heating (and the reason that only the bottom is copper).  Since copper can dissipate heat very well, the heat is spread 
>across the pan more evenly.  It is "large" to limit warping, provide a reserve, and still provide even heating when cold food is thrown on it.  
>
Interesting.  I might just have to get some copper pans now.

>A copper pan of will actually cool down ... quicker then a aluminum ... pan 
>
>of equal size.     
>
Hmmm.  That's what I thought before, but that article seems to say 
otherwise:

>While copper is a good conductor of *heat*,
>it is inferior to *aluminum* for getting rid of the *heat* it has absorbed. 
>
And it makes sense.  Foil is usually cool enough to grab out of a heated 
oven with my hands.  But then again, i've never tried copper foil, so 
maybe that's
not such a fair example.

>Correct..
>Higher number means more heat transfer
>
>Thermal Conductivity, W/cm-K
>Aluminum 2.165 
>Copper 3.937 
>Gold 2.913 
>Iron .669 
>Silver 4.173 
>  
>
Yeah, that looks familar.   I think i remember reading that when i took 
physics.

>The fins increase the surface area exposed to the air flow allowing more cooling.  Just as a soda dumped on a hot sidewalk will warm up much quicker then if it was sitting 
>in a can on the same sidewalk.   
>
That makes perfect sense.

>Here is an interesting page about copper and aluminum  (I used a Google cache because I could not get to the leading page from the site directly) -->
>
>http://216.239.35.100/search?q=cache:pXcbnqmZaPkC:www.benchtest.com/alum%26copp.html+specific+heat+capacity+aluminum&hl=en&ie=UTF-8  
>  
>
This pages logic seems strange to me.  If aluminum transfers heat slower 
than copper, then wouldn't using a copper base and aluminum fins create a
heat build up in the base?  I mean the fins wouldn't be able to receive 
the heat as fast as the copper can give it out, so wouldn't that be a 
bottleneck that
would limit efficiency?

--Ray