[luau] Underclocking / dead horses

[Jim Roby]

What you are missing is,the CPU is the heat source as was your torch,
the copper is grabing the heat faster than the steel and transfering it
away from the torch/CPU.I it were economical,you would use silver rather
than copper,but copper is cheaper and easier to work.

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ps6500bcu

check out this link to the Zalman CPU cooler solution,the current
sweetheart of the overclockers...it is also a beautiful peice of
industrial design.


 On Thu, 4 Jul 2002, Joe Linux wrote:

> We've sort of beat this subject to death, but I think what we are 
> looking for is a material that will quickly move the heat away from the 
> source (processor chip) and then quickly give it up to the air.  My gut 
> feeling is that copper "holds" heat. whereas steel tends to give it up. 
>  I used to build custom marine refrigeration systems and it seems to me 
> that when you solder a copper tube, the heat stays with it longer, 
> whereas with steel the heat doesn't travel the tube as much.  It tends 
> to stay at the heat source and then cool down more quickly once the 
> flame is removed.  It may have been said before, but the idea behind 
> fins is that they greatly increase the surface area and thus give up 
> more heat to the air.  Actually fans always improve cooling.  The issue 
> Wayne has is that he wants to eliminate the fan noise.  Perhaps another 
> approach would be to continue with a fan in a case with good ducting but 
> concentrate on the noise reduction of the fans.  It could be that these 
> fans have resonate frequencies that are sympathetic with the case so 
> it's possible that some sound deadening material applied to the outside 
> of the case could greatly improve the situation.
> 
> MonMotha wrote:
> 
> > The characteristic you're looking to minimize is Thermal Resistance. 
> > I'm no thermo expert though so possibly do some googling on what that 
> > is exactly.
> >
> > Copper will tend to suck the heat away faster and then the objective 
> > of the "fins" is to maximize contact between the copper and the air 
> > (much larger surface area than cpu core alone) to improve conduction 
> > between air and copper as the copper to copper conduction will occur 
> > readily to transfer the heat from the area of the CPU core up to the 
> > fins.
> >
> > --MonMotha
> 
> 
> 
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